We dedicated the past four years to creating world competitive cSi low bow BSF aluminum, high reliability and low silver back contact and high performance front contact pastes. Our latest formulations mastered high speed printing of 40 micron wide fingers for high resistance shallow emitter wafers
We have over 75 years of experience developing, manufacturing and processing thick film materials. Applications span from thermistors to components with substrates from alumina to stainless steel. More
Solid Oxide Fuel Cells
We can support development and manufacture of YSZ and ScSZ electrolyte materials in component, paste, slurry and/or tape forms. On-site tape casting, press and punch capabilities also support pilot and prototype requirements.
Managing heat is critical with these component types. We have the material science experience with LED's on a variety of substrate materials to increase performance and extend service life. Let us enhance the thermal performance of power IC die attach with new lead free material solutions.
Low Temperature Co-fired Ceramics
Tape and paste formulation with tape casting on-premises. Full capability to perform design, R&D activities, Development partners for glass and other raw material requirements.
Surface Mount Technology
Our experts have over 25 years of hands-on engineering experience in SMT. This experience carries over into semiconductor packaging materials applications and testing.